The Speakers
Professor
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Assoc. Prof.
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Assoc. Prof.
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Professor
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Professor
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University of Queensland
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Universiti Sains Malaysia
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Universiti Teknologi MARA
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National Taiwan University
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National Central University
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Professor Kazuhiro Nogita
Professor
School of Mechanical and Mining Engineering, University of Queensland
Director
Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM)
School of Mechanical and Mining Engineering, University of Queensland
Director
Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM)
Biography
Professor Nogita graduated as an Engineer in Japan in 1990 and worked in the nuclear power industry with Hitachi Ltd. He was awarded a PhD from Kyushu University in 1997. He migrated to Australia in 1999 after accepting a position at the University of Queensland, where he became the founding director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) in 2012 as well as project manager of the University of Queensland – Kyushu University Oceania project (UQ-KU project) and Deputy Chair of the International Development and Engagement Committee at the School of Mechanical and Mining Engineering. He is also an invited Professor at Kyushu University and a Research Adviser at the University of Malaysia Perlis. His research is in three major areas, namely lead-free solders and interconnect materials, energy materials such as hydrogen-storage alloys, and structural and coating alloy development. He holds 19 international patents and has authored over 250 refereed scientific papers. He is a deputy chair for the Electronic Packaging and Interconnection Materials (EPIM) Committee (since 2022), and Leading organiser (2019 and 2023) and Co-organiser of the “Emerging interconnect and Pb-free materials for advanced packaging technology” symposium at TMS in the USA, from 2015 to the current date. He is the recipient of the TMS Research to Industrial Practice Award in 2021.
Title:
Advanced characterisation techniques for Pb-free solder alloy and intermetallics developments for electric interconnects: Case studies
Abstract:
This keynote talk provides an overview of how advanced characterisation approaches, such as Synchrotron X-ray radiation facilities and state-of-art electron microscopy, can be used to optimise and develop Pb-free solder alloys and associated intermetallics that form between the solder alloys and substrates of electronic interconnects. The following three practical/experimental advanced approaches will be discussed along with their use in international collaborative projects, (1) Synchrotron X-ray diffraction at the Australian Synchrotron, (2) Synchrotron X-ray imaging at the SPring-8 synchrotron, and (3) State-of-art electron microscopy at The University of Queensland and Kyushu University.
Advanced characterisation techniques for Pb-free solder alloy and intermetallics developments for electric interconnects: Case studies
Abstract:
This keynote talk provides an overview of how advanced characterisation approaches, such as Synchrotron X-ray radiation facilities and state-of-art electron microscopy, can be used to optimise and develop Pb-free solder alloys and associated intermetallics that form between the solder alloys and substrates of electronic interconnects. The following three practical/experimental advanced approaches will be discussed along with their use in international collaborative projects, (1) Synchrotron X-ray diffraction at the Australian Synchrotron, (2) Synchrotron X-ray imaging at the SPring-8 synchrotron, and (3) State-of-art electron microscopy at The University of Queensland and Kyushu University.
Assoc. Prof. Ts. Dr. Mohd Sharizal Abdul Aziz
Associate Professor
School of Mechanical Engineering, Engineering Campus,
Universiti Sains Malaysia, Penang, Malaysia.
Biography
Mohd Sharizal Abdul Aziz received his B.Eng., M.Sc., and PhD degrees from Universiti Sains Malaysia, Malaysia, in 2006, 2012, and 2015. Sharizal is currently an Associate Professor at the School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Penang, Malaysia. He has authored a book and numerous papers published in international journals and conference proceedings focusing on Electronic Packaging.
In addition to his scholarly contributions, Sharizal has delivered numerous invited/keynote talks at international conferences. Furthermore, he has played a pivotal role in organizing workshops on Computational Fluid Dynamics (CFD) for academics and professionals in collaboration with GLC companies and Microelectronics industries in Malaysia.
Sharizal's research interests encompass Advanced Packaging & SMT, CFD, and Fluid-Structure Interaction (FSI). Notably, he is registered with the Board of Engineers Malaysia, the Institution of Engineers Malaysia (IEM), the Malaysia Board of Technologists (MBOT), and holds the distinction of being a fellow of the Electronics Packaging Research Society, Malaysia.
In addition to his scholarly contributions, Sharizal has delivered numerous invited/keynote talks at international conferences. Furthermore, he has played a pivotal role in organizing workshops on Computational Fluid Dynamics (CFD) for academics and professionals in collaboration with GLC companies and Microelectronics industries in Malaysia.
Sharizal's research interests encompass Advanced Packaging & SMT, CFD, and Fluid-Structure Interaction (FSI). Notably, he is registered with the Board of Engineers Malaysia, the Institution of Engineers Malaysia (IEM), the Malaysia Board of Technologists (MBOT), and holds the distinction of being a fellow of the Electronics Packaging Research Society, Malaysia.
Assoc. Prof. Dr. Mohd Muzamir Mahat
Associate Professor
Faculty of Applied Sciences,
Universiti Teknologi MARA, Shah Alam, Malaysia.
Biography
Dr. Mohd Muzamir Mahat is an Associate Professor of Materials Science in the Faculty of Applied Sciences (FSG) at Universiti Teknologi MARA (UiTM), Shah Alam, Malaysia. Dr. Muzamir joined FSG in 2010 after completing his Master's in Mechanical Engineering (Materials) at Universiti Teknologi Malaysia, Johor, and a Bachelor's in Materials Technology (First-Class Honors) from UiTM in 2008.
In 2013, Dr. Muzamir was awarded the prestigious Biasiswa Yang Dipertuan Agong scholarship, as one of the top six recipients in Malaysia, to pursue his PhD at Imperial College London, United Kingdom. He joined the Stevens Group under the supervision of Professor Molly Stevens and Professor David Payne. His project focused on the surface characterization of biomaterials using X-ray photoelectron spectroscopy (XPS). Dr. Muzamir completed his PhD in 2017 and established his research group, addressing the challenges of bioelectronic materials and utilizing fabrics as substrates for improvements in flexibility and other functionalities.
Throughout the years, he has been awarded numerous research grants at the internal, national, and international levels. He is currently supervising 4 PhD students and 3 Master's students as the main supervisor, and eight of his postgraduate students, including five PhD and three Master's students, have successfully completed their degrees. Dr. Muzamir has won several innovation awards at MTE and IIDEX, showcasing his research excellence for direct application in real-world environments. Other awards include the RSC travel grant, the Imperial College Malaysian Top Scholar, member of the Best Research Group at Imperial College, the UiTM academic award, and the Excellent Service Award.
Dr. Muzamir's research work has received funding from various sources, including the Ministry of Higher Education Malaysia, PETRONAS, and private funders. These grants have enabled him and his research group to conduct cutting-edge research in advanced materials, bioelectronics, and energy. His research outcomes, particularly in polymer networks, have the potential to impact society significantly, from improving the performance of lithium-ion recycling technology devices to developing novel materials for medical applications.
In 2013, Dr. Muzamir was awarded the prestigious Biasiswa Yang Dipertuan Agong scholarship, as one of the top six recipients in Malaysia, to pursue his PhD at Imperial College London, United Kingdom. He joined the Stevens Group under the supervision of Professor Molly Stevens and Professor David Payne. His project focused on the surface characterization of biomaterials using X-ray photoelectron spectroscopy (XPS). Dr. Muzamir completed his PhD in 2017 and established his research group, addressing the challenges of bioelectronic materials and utilizing fabrics as substrates for improvements in flexibility and other functionalities.
Throughout the years, he has been awarded numerous research grants at the internal, national, and international levels. He is currently supervising 4 PhD students and 3 Master's students as the main supervisor, and eight of his postgraduate students, including five PhD and three Master's students, have successfully completed their degrees. Dr. Muzamir has won several innovation awards at MTE and IIDEX, showcasing his research excellence for direct application in real-world environments. Other awards include the RSC travel grant, the Imperial College Malaysian Top Scholar, member of the Best Research Group at Imperial College, the UiTM academic award, and the Excellent Service Award.
Dr. Muzamir's research work has received funding from various sources, including the Ministry of Higher Education Malaysia, PETRONAS, and private funders. These grants have enabled him and his research group to conduct cutting-edge research in advanced materials, bioelectronics, and energy. His research outcomes, particularly in polymer networks, have the potential to impact society significantly, from improving the performance of lithium-ion recycling technology devices to developing novel materials for medical applications.
Title:
Future Directions in Conductive Polymer Networks: Pioneering Applications in Bioelectronics and Energy
Abstract:
At the forefront of innovation in green materials and electronic packaging interconnect technology, our research group is leading the way with the development of conductive polymer networks designed for cutting-edge applications in bioelectronics and energy systems. This transformative work explores the potent synergy between advanced material science and practical applications, yielding groundbreaking advancements in both fields. Our pioneering efforts have resulted in the creation of highly conductive hydrogel materials and fabrics, tailored specifically for the restoration of spinal cord injuries and the facilitation of wound healing. These advancements represent a significant leap forward in the domain of medical bioelectronics, offering new hope and possibilities for rehabilitation and recovery. The unique electrical properties of our conductive polymer networks have been meticulously harnessed to enhance the functionality and efficacy of these bioelectronic devices, thereby setting a new benchmark in therapeutic interventions. Furthermore, our novel polymer network has been adeptly applied as a membrane in the rejuvenation of lithium-ion batteries, showcasing its ability to enhance the durability and efficiency of energy storage systems. This dual utility underscores the polymer network's significance in advancing both bioelectronic medical devices and sustainable energy technologies. Our findings not only underscore the polymer network's adaptability and efficiency but also mark a significant contribution to the fields of bioelectronics and green energy, paving the way for future innovations in material science and engineering.
Future Directions in Conductive Polymer Networks: Pioneering Applications in Bioelectronics and Energy
Abstract:
At the forefront of innovation in green materials and electronic packaging interconnect technology, our research group is leading the way with the development of conductive polymer networks designed for cutting-edge applications in bioelectronics and energy systems. This transformative work explores the potent synergy between advanced material science and practical applications, yielding groundbreaking advancements in both fields. Our pioneering efforts have resulted in the creation of highly conductive hydrogel materials and fabrics, tailored specifically for the restoration of spinal cord injuries and the facilitation of wound healing. These advancements represent a significant leap forward in the domain of medical bioelectronics, offering new hope and possibilities for rehabilitation and recovery. The unique electrical properties of our conductive polymer networks have been meticulously harnessed to enhance the functionality and efficacy of these bioelectronic devices, thereby setting a new benchmark in therapeutic interventions. Furthermore, our novel polymer network has been adeptly applied as a membrane in the rejuvenation of lithium-ion batteries, showcasing its ability to enhance the durability and efficiency of energy storage systems. This dual utility underscores the polymer network's significance in advancing both bioelectronic medical devices and sustainable energy technologies. Our findings not only underscore the polymer network's adaptability and efficiency but also mark a significant contribution to the fields of bioelectronics and green energy, paving the way for future innovations in material science and engineering.
Professor Dr. C Robert Kao
Distinguished Professor
Department of Materials Science and Engineeering,
National Taiwan University, Taiwan
Biography
Professor C. Robert Kao received his Ph.D. in Materials Science from University of Wisconsin at Madison in 1994. He joined Department of Chemical & Materials Engineering of National Central University in 1995. He then became the first director for the newly established Institute of Materials Science & Engineering at National Central University in 2005. In 2006, he relocated to National Taiwan University, and became a University Distinguished Professor there. His main research interests include electronic, optical, and MEMS packaging with a main thrust on the thermodynamics and kinetics of materials interactions within packages. He has authored over 200 technical papers, five of which are classified as Highly Cited Papers by ISI Essential Science Indicators, and holds 5 ROC patents and 3 US patents. He has been invited speakers in many international conferences. He is a consultant to many leading advanced packaging companies, including TSMC, Unimicron, ASE, and SPIL.
Title:
Interconnection Technologies for Advanced Electronic Packaging
Abstract:
Interconnection Technologies for Advanced Electronic Packaging
Abstract:
Professor Dr. Albert Tzu-Chia Wu
Professor
Department of Chemical and Materials Engineering
National Central University, Taiwan
Biography
Prof. Wu earned a bachelor's degree in Materials Science and Engineering from National Tsing Hua University in June 1996, followed by a master's degree from National Chiao Tung University in July 2000. He completed a Ph.D. at the University of California, Los Angeles, in December 2004. Since August 2012, Prof. Wu has served as a Professor in the Department of Chemical and Materials Engineering at National Central University. His research centers on reliability issues in advanced electronic packaging, functional thin film materials, and thermoelectric modules. Beyond teaching and research, Prof. Wu has held several key administrative roles at the university, including Associate Dean of the College of Engineering, Associate Vice President for the Office of International Affairs, Director of the Career Center, and Chair of the Department of Chemical and Materials Engineering. Prof. Wu is also an active member of the academic community, serving as an editor for prestigious journals such as the Journal of Electronic Materials, JOM, and Microelectronics Reliability. Additionally, Prof. Wu plays a leading role in the scientific community by organizing key symposia, including TMS, MS&T, and IUMRS, demonstrating a commitment to advancing the field of materials science and engineering.
Title:
Advancements in Interconnect Technology: The Role of Sintered Cu Nanoparticle Joints
Abstract:
Advancements in Interconnect Technology: The Role of Sintered Cu Nanoparticle Joints
Abstract:
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