EPITS
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ABOUT EPITS 2024
In the extensive technology era, the industry was pushing the limits in both design and manufacturing areas. Small scale microelectronics technologies those in the micro and nano-scale area are the most exciting developments. Researchers working at or near the molecular level have recently made significant breakthroughs that will enable companies to create entirely new products, applications, and highly efficient manufacturing techniques. These applications products required excellent performance that allowed to withstand in harsh environments which is thermal stresses, vibration and shock. Therefore, its has been a great deal of research and innovation concerning robust design and the selection of novel materials. Some of the most spectacular developments in electronics packaging are now beginning to take shape.

Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2024) is bringing together packaging experts in these critical areas and others to sharing and exchange the ideas in electronics technology. Don’t miss your chance to get up to speed on today’s most important topics in packaging, all in one place.
EPITS 2024
​​​Topics of interest or submission include, but are not limited to:
  • Green materials and technology
  • Emerging interconnect materials and technologies
  • Non-solder interconnect materials at chip and package levels
  • Fundamental materials behavior for electronic packaging materials
  • Advanced characterization methods as applied to electronic packaging technology
  • Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
  • Surface coating materials
  • Advanced materials.
*All accepted quality papers for EPITS 2024 will be published in Book series Springer Proceedings in Physics (Scopus).

IMPORTANT DATES

SUBJECT
DEADLINE
Abstract Submission​
​20 MAY 2024
Paper Acceptance Notification
30 MAY 2024
Full Paper Submission &
​Early Bird Payment 
​15 JUNE 2024
Full Paper Submission
​15 JULY 2024
Full Paper Submission Camera Ready
​31 JULY 2024
Payment Confirmation
​31 JULY 2024

REGISTRATION FEES

Registration
​Local Participant
​International Participant
Early Bird Registration
  • second paper onwards
MYR 950
​​MYR 850
USD 450
​USD 400
Normal Registration
  • second paper onwards
MYR 1,000
​​MYR 900
USD 500
​USD 450
​Listener
MYR 500
USD 200
Workshop
MYR 500
USD 200
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Keynote Speakers

​Professor Kazuhiro Nogita
​University of Queensland, Australia
Assoc. Prof. Ts. Dr. Mohd Sharizal Abdul Aziz
​Universiti Sains Malaysia, Malaysia
Assoc. Prof. Dr. Mohd Muzamir Mahat​
​Universiti Teknologi MARA, Malaysia
Professor Dr. Albert T. Wu​
National Central University, Taiwan
Professor Dr. C. Robert Kao
National Taiwan University, Taiwan
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Poster
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Flag Counter

Contact Person

Associate Professor Ts. Dr. Dewi Suriyani Che Halin
([email protected])
Electronic Packaging Research Group,
Center of Excellent Geopolymer and Green Technology,
Universiti Malaysia Perlis (UniMAP)
​([email protected])
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  • Home
    • Call for Papers
  • For Author
    • Registration/Payment
  • The Speakers
  • Synchrotron Workshop
  • Venue
  • Contact Us
    • Committee