ABOUT EPITS 2024
In the extensive technology era, the industry was pushing the limits in both design and manufacturing areas. Small scale microelectronics technologies those in the micro and nano-scale area are the most exciting developments. Researchers working at or near the molecular level have recently made significant breakthroughs that will enable companies to create entirely new products, applications, and highly efficient manufacturing techniques. These applications products required excellent performance that allowed to withstand in harsh environments which is thermal stresses, vibration and shock. Therefore, its has been a great deal of research and innovation concerning robust design and the selection of novel materials. Some of the most spectacular developments in electronics packaging are now beginning to take shape.
Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2024) is bringing together packaging experts in these critical areas and others to sharing and exchange the ideas in electronics technology. Don’t miss your chance to get up to speed on today’s most important topics in packaging, all in one place.
Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2024) is bringing together packaging experts in these critical areas and others to sharing and exchange the ideas in electronics technology. Don’t miss your chance to get up to speed on today’s most important topics in packaging, all in one place.
Topics of interest or submission include, but are not limited to:
- Green materials and technology
- Emerging interconnect materials and technologies
- Non-solder interconnect materials at chip and package levels
- Fundamental materials behavior for electronic packaging materials
- Advanced characterization methods as applied to electronic packaging technology
- Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
- Surface coating materials
- Advanced materials.
*All accepted quality papers for EPITS 2024 will be published in Book series Springer Proceedings in Physics (Scopus).
IMPORTANT DATES
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REGISTRATION FEES
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Keynote SpeakersProfessor Kazuhiro Nogita
University of Queensland, Australia Assoc. Prof. Ts. Dr. Mohd Sharizal Abdul Aziz
Universiti Sains Malaysia, Malaysia Assoc. Prof. Dr. Mohd Muzamir Mahat
Universiti Teknologi MARA, Malaysia Professor Dr. Albert T. Wu
National Central University, Taiwan Professor Dr. C. Robert Kao
National Taiwan University, Taiwan |
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Poster
Contact PersonAssociate Professor Ts. Dr. Dewi Suriyani Che Halin
([email protected]) |
Electronic Packaging Research Group,
Center of Excellent Geopolymer and Green Technology, Universiti Malaysia Perlis (UniMAP) ([email protected]) |
