Topics of Interest
1. Green materials and technology
2. Emerging interconnect materials and technologies
3. Non-solder interconnect materials at chip and package levels
4. Fundamental materials behavior for electronic packaging materials
5. Advanced characterization methods as applied to electronic packaging technology
6. Developments in high temperature Pb-free solders and associated interconnects for
automotive and power electronics
7. Surface coating materials
8. Advanced materials.
2. Emerging interconnect materials and technologies
3. Non-solder interconnect materials at chip and package levels
4. Fundamental materials behavior for electronic packaging materials
5. Advanced characterization methods as applied to electronic packaging technology
6. Developments in high temperature Pb-free solders and associated interconnects for
automotive and power electronics
7. Surface coating materials
8. Advanced materials.
*All accepted quality papers for EPITS 2024 will be published in Book series Springer Proceedings in Physics (Scopus).
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